SURFACE PROCESSING APPARATUS
A surface processing device capable of forming a wafer to a uniform thickness without causing a decrease in bending strength is provided. A processing unit of the surface processing device that processes the surface of a workpiece comprises: a laser oscillator that emits a laser beam; a condenser th...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
03.07.2023
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Subjects | |
Online Access | Get full text |
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