SURFACE PROCESSING APPARATUS

A surface processing device capable of forming a wafer to a uniform thickness without causing a decrease in bending strength is provided. A processing unit of the surface processing device that processes the surface of a workpiece comprises: a laser oscillator that emits a laser beam; a condenser th...

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Bibliographic Details
Main Author NOMARU KEIJI
Format Patent
LanguageEnglish
Korean
Published 03.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A surface processing device capable of forming a wafer to a uniform thickness without causing a decrease in bending strength is provided. A processing unit of the surface processing device that processes the surface of a workpiece comprises: a laser oscillator that emits a laser beam; a condenser that forms the laser beam emitted by the laser oscillator into a plurality of beams; a collimating lens disposed between the laser oscillator and the condenser to collimate the laser beam into parallel light; a beam intensity adjuster disposed between the condenser and the collimating lens to adjust the intensity of the plurality of beams; and a rotating mechanism that rotates the condenser. (과제) 항절 강도의 저하를 초래하지 않고, 웨이퍼를 균일한 두께로 형성할 수 있는 면처리 장치를 제공한다. (해결 수단) 피가공물의 면을 처리하는 면처리 장치의 처리 유닛은, 레이저 광선을 출사하는 레이저 발진기와, 레이저 발진기가 출사한 레이저 광선을 복수의 빔으로 형성하는 집광기와, 레이저 발진기와 집광기 사이에 배치 형성되어, 레이저 광선을 평행광에 콜리메이트하는 콜리메이트 렌즈와, 집광기와 콜리메이트 렌즈 사이에 배치 형성되어 복수의 빔의 강도를 조정하는 빔 강도 조정기와, 집광기를 회전하는 회전 기구를 포함한다.
Bibliography:Application Number: KR20220162554