DOUBLE LAYERED ELETROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF

• Main Authors: MOON HONGGI, SEUNGHWAN KIM, SANGBEOM KIM
• Format: Patent
• Language: English; Korean
• Published: 03.07.2023
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; TRANSPORTING

Provided are a double-layer electrolytic copper foil, which can freely control all properties of a copper foil as desired, and a manufacturing method thereof. The double-layer electrolytic copper foil of the present invention comprises: a first copper layer; a second copper layer; and the interface. 본 발명은 동박의 제반 물성을 원하는 대로 자유롭게 제어할 수 있는 이중층 전해동박 및 그 제조방법을 제공한다.