직접 접합 방법 및 구조체
접합 방법은 제 1 요소의 제 1 접합층을 제 2 요소의 제 2 접합층에 직접 접합되도록 활성화하는 단계를 포함할 수 있다. 접합 방법은, 상기 활성화하는 단계 이후에, 제 1 요소의 활성화된 제 1 접합층 위에 보호층을 제공하는 단계를 포함할 수 있다. A bonding method can include activating a first bonding layer of a first element for direct bonding to a second bonding layer of a second element. The bondin...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Korean |
| Published |
28.06.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | 접합 방법은 제 1 요소의 제 1 접합층을 제 2 요소의 제 2 접합층에 직접 접합되도록 활성화하는 단계를 포함할 수 있다. 접합 방법은, 상기 활성화하는 단계 이후에, 제 1 요소의 활성화된 제 1 접합층 위에 보호층을 제공하는 단계를 포함할 수 있다.
A bonding method can include activating a first bonding layer of a first element for direct bonding to a second bonding layer of a second element. The bonding method can include, after the activating, providing a protective layer over the activated first bonding layer of the first element. |
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| AbstractList | 접합 방법은 제 1 요소의 제 1 접합층을 제 2 요소의 제 2 접합층에 직접 접합되도록 활성화하는 단계를 포함할 수 있다. 접합 방법은, 상기 활성화하는 단계 이후에, 제 1 요소의 활성화된 제 1 접합층 위에 보호층을 제공하는 단계를 포함할 수 있다.
A bonding method can include activating a first bonding layer of a first element for direct bonding to a second bonding layer of a second element. The bonding method can include, after the activating, providing a protective layer over the activated first bonding layer of the first element. |
| Author | MIRKARIMI LAURA WILLS UZOH CYPRIAN EMEKA FOUNTAIN JR. GAIUS GILLMAN GAO GUILIAN |
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| RelatedCompanies | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC |
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| Snippet | 접합 방법은 제 1 요소의 제 1 접합층을 제 2 요소의 제 2 접합층에 직접 접합되도록 활성화하는 단계를 포함할 수 있다. 접합 방법은, 상기 활성화하는 단계 이후에, 제 1 요소의 활성화된 제 1 접합층 위에 보호층을 제공하는 단계를 포함할 수 있다.
A bonding method... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | 직접 접합 방법 및 구조체 |
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