COOLING APPARATUS FOR POWER MODULE

A cooling device for a power module includes a plurality of cooling modules prepared to individually contact both sides of the power module. In the cooling device for a power module, a cooling module comprises: a manifold cover having a plurality of guide walls extending in a first direction while b...

Full description

Saved in:
Bibliographic Details
Main Authors KWON SE HEUN, LEE SEONG MIN, KANG MIN SOO, LEE HYOUNG SOON, LEE GEON HEE, PARK HYONG JOON, LEE SANG HUN, KIM YUN SEO, KONG DAE YOUNG, LEE JE HWAN
Format Patent
LanguageEnglish
Korean
Published 27.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A cooling device for a power module includes a plurality of cooling modules prepared to individually contact both sides of the power module. In the cooling device for a power module, a cooling module comprises: a manifold cover having a plurality of guide walls extending in a first direction while being spaced apart; and a pin plate having one surface in contact with a power module and a plurality of pins extending in a second direction that intersects the first direction on the other surface. 파워모듈의 양면 각각에 접하도록 마련된 복수의 냉각모듈을 포함하는 파워모듈용 냉각장치로서, 냉각모듈이 이격된 상태로 제1방향으로 연장된 복수의 가이드벽을 구비하는 매니폴드 커버 및 일면이 파워모듈과 접하고 타면에 복수의 핀이 제1방향과 교차되는 제2방향으로 연장된 핀 플레이트를 포함하는 파워모듈용 냉각장치가 소개된다.
Bibliography:Application Number: KR20210183141