Printed circuit board

Disclosed is a printed circuit board. The printed circuit board according to the present invention comprises: a core member formed with a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer stacked on both surfaces of the core member and the sub-circuit board; an...

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Bibliographic Details
Main Authors CHO JUNG HYUN, BAEK YONG HO, KOOK SEUNG YEOP
Format Patent
LanguageEnglish
Korean
Published 26.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a printed circuit board. The printed circuit board according to the present invention comprises: a core member formed with a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer stacked on both surfaces of the core member and the sub-circuit board; and an insulating material filled between an inner wall of the through-hole and the sub-circuit board. 인쇄회로기판이 개시된다. 본 발명에 따른 인쇄회로기판은 관통홀이 형성된 코어부재, 관통홀에 배치된 서브 회로기판, 코어부재 및 서브 회로기판의 양면에 적층된 제1 절연층 및 관통홀의 내벽과 서브 회로기판 사이에 충진된 절연재를 포함한다.
Bibliography:Application Number: KR20230076819