VARNISH COMPOSITION METHOD OF PRODUCING VARNISH COMPOSITION AND METHOD OF PRODUCING POLYIMIDE RESIN

• Main Authors: SAIJO HIDEKI, TADOKORO YOSHINORI
• Format: Patent
• Language: English; Korean
• Published: 26.06.2023
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention is to provide a varnish composition capable of forming a polyimide resin having both low coloring and excellent mechanical properties, a method for manufacturing the varnish composition, and a method for manufacturing the polyimide resin using the varnish composition. The present invention, in the varnish composition containing a polyamic acid (A) and a solvent (S), uses the polyamic acid (A) having a weight average molecular weight of 20,000 or more, an imidazole compound (B) having a specific structure, and a solvent (S) having a content of urea-based solvent (S1) of 0 to 10 mass%. [과제] 착색의 적음과 우수한 기계적 특성을 겸비하는 폴리이미드 수지를 형성할 수 있는 바니시 조성물과, 당해 바니시 조성물의 제조 방법과, 당해 바니시 조성물을 사용하는 폴리이미드 수지의 제조 방법을 제공하는 것. [해결 수단] 폴리아믹산 (A) 와, 용매 (S) 를 함유하는 바니시 조성물에 있어서, 중량 평균 분자량이, 20,000 이상인 폴리아믹산 (A) 와, 특정한 구조의 이미다졸 화합물 (B) 와, 우레아계 용매 (S1) 의 함유량이 0 질량％ 이상 10 질량％ 이하인 용매 (S) 를 사용한다.