X- X-RAY IMAGING DEVICE
The present specification relates to an X-ray imaging device that comprises: a mobile substrate (100) having electrical connection components; an array of pixels, each of which comprises a monolithic base chip (153) bonded and electrically connected to the electrical connection components of the mob...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
09.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present specification relates to an X-ray imaging device that comprises: a mobile substrate (100) having electrical connection components; an array of pixels, each of which comprises a monolithic base chip (153) bonded and electrically connected to the electrical connection components of the mobile substrate (100) and a direct conversion X photon detector (XD) electrically connected to the base chip (153). For each pixel, the basic chip (153) has an integrated circuit for reading of the detector (XD) of the pixel. Therefore, it is possible to directly obtain an image representing the distribution of X-rays received by a conversion material.
본 명세서는 - 전기 접속 구성요소들을 구비하는 이동 기판(100)과, - 픽셀들의 어레이로서, 각각이 상기 이동 기판(100)의 전기 접속의 구성요소들에 접합되어 전기적으로 접속된 모놀리식 기본 칩(153)과, 상기 기본 칩(153)에 전기적으로 접속된 직접 변환 X 광자 검출기(XD)를 구비하는 픽셀들의 어레이 를 구비하고, 각 픽셀에서, 상기 기본 칩(153)은 상기 픽셀의 상기 검출기(XD)의 판독을 위한 집적 회로를 구비하는 X-선 이미징 장치에 관한 것이다. |
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Bibliography: | Application Number: KR20220164471 |