ENCAPSULATION FILM

• Main Authors: CHOI KWANG HUI, RYU JAE SEOL, RYU DONG HWAN, YOON JHIN YEONG, SEO BEOM DOO
• Format: Patent
• Language: English; Korean
• Published: 08.06.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present application relates to an encapsulation film, a manufacturing method thereof, an organic electronic device including the same, and a manufacturing method of the organic electronic device using the same. Provided is the encapsulation film which can form a structure capable of blocking moisture or oxygen flowing into the organic electronic device from the outside, thereby obtaining long-term reliability of the organic electronic device and preventing physical and chemical damage to an organic electronic element. 본 출원은 봉지 필름, 이의 제조 방법, 이를 포함하는 유기전자장치 및 이를 이용한 유기전자장치의 제조 방법에 관한 것으로서, 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 차단할 수 있는 구조의 형성이 가능하고, 유기전자장치의 장기 신뢰성이 확보될 수 있으며, 유기전자소자의 물리적, 화학적 손상을 방지할 수 있는 봉지 필름을 제공한다.