Sn-Ag-Cu plating solution for producing probe card

• Main Authors: JUNG WOO KO, KIM DONG HYUN, LEE SEONG JOON
• Format: Patent
• Language: English; Korean
• Published: 02.06.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; METALLURGY; PHYSICS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TESTING

The present invention relates to a Sn-Ag-Cu plating solution for producing probe cards. The Sn-Ag-Cu plating solution for producing probe cards of the present invention is suitable for producing probe cards. The Sn-Ag-Cu plating solution for producing probe cards of the present invention can greatly reduce the amount of whiskers in solder. The Sn-Ag-Cu plating solution for producing probe cards of the present invention can greatly reduce the amount of voids in solder. The tin-silver-copper plating solution for manufacturing probe cards of the present invention can significantly reduce the melting point of solder, thereby improving the overall semiconductor manufacturing process. To achieve the purpose, the Sn-Ag-Cu plating solution for producing probe cards comprises: tin ions at a concentration in the range of 40 g/L to 125 g/L; silver ions at a concentration in the range of 1 g/L to 2 g/L; copper ions at a concentration in the range of 0.1 g/L to 0.5 g/L; anions derived from methanesulfonic acid; ingredients derived from surfactants; ingredients derived from a complexing agent which is a mixture of bis(2-hydroxyethyl)sulfide ethoxylate and succinic imide; and ingredients derived from a benzamide 2,2'-dithiobisine additive. 본 발명은 프로브카드 제조용 주석-은-구리 도금액에 관한 것이다. 본 발명의 프로브카드 제조용 주석-은-구리 도금액은 프로브카드 제조에 적합하다. 본 발명의 프로브카드 제조용 주석-은-구리 도금액은 솔더의 휘스커의 양을 크게 줄일 수 있다. 본 발명의 프로브카드 제조용 주석-은-구리 도금액은 솔더의 보이드의 양을 크게 줄일 수 있다. 본 발명의 프로브카드 제조용 주석-은-구리 도금액은 솔더의 융점을 크게 감소시켜서 전반적으로 반도체 제조 공정을 개선할 수 있다.