Ultra High Speed Cu Electroplating Solution for ECAM

• Main Authors: CHUNG KUN WOOK, LEE DUKHAENG
• Format: Patent
• Language: English; Korean
• Published: 31.05.2023
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TRANSPORTING

The present invention develops and proposes an ultra-high-speed copper electrolytic plating solution and additives that can be used in an electrochemical vertical stacking (bottom up) process using ECAM, Electro Chemical Additive Manufacturing, one of the latest PCB circuit pattern manufacturing met...