Ultra High Speed Cu Electroplating Solution for ECAM

• Main Authors: CHUNG KUN WOOK, LEE DUKHAENG
• Format: Patent
• Language: English; Korean
• Published: 31.05.2023
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TRANSPORTING

The present invention develops and proposes an ultra-high-speed copper electrolytic plating solution and additives that can be used in an electrochemical vertical stacking (bottom up) process using ECAM, Electro Chemical Additive Manufacturing, one of the latest PCB circuit pattern manufacturing methods. The copper electrolytic plating solution contains 50-52 wt% of copper sulfate aqueous solution, 45-50 wt% of sulfuric acid, 0.05-0.1 wt% of chlorine ion, 0.03-0.05 wt% of bis-(3-sulfopropyl)-disulfide, and 1.5-2.0 wt% of polyethylene glycol, and is used in the vertical stacking process. 본 발명은 최신 PCB 회로패턴 제조 공법 중 하나인 ECAM, Electro Chemical Additive Manufacturing을 활용한 전기화학 수직 적층 (bottom up) 공정에서 사용할 수 있는 초고속용 구리 전해 도금액 및 첨가제를 개발 및 제안하는 것이다.