Apparatus for bonding chip and method for bonding chip using the same

According to an embodiment of the present invention, a chip bonding device comprises: a body; a substrate transfer unit installed on the body to transfer a substrate; a bond head transfer unit disposed on an upper surface of the body; an alignment unit installed on the body and confirming a position...

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Bibliographic Details
Main Authors CHOI EUI SUN, HONG YUN PYO, KIM HUI JAE, CHEONG HYEONG GYUN, LEE MIN GU
Format Patent
LanguageEnglish
Korean
Published 31.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:According to an embodiment of the present invention, a chip bonding device comprises: a body; a substrate transfer unit installed on the body to transfer a substrate; a bond head transfer unit disposed on an upper surface of the body; an alignment unit installed on the body and confirming a position of the substrate and a position of a chip; and a bond head installed in the bond head transfer unit to be moved and adsorbing the chip at a lower part. The bond head is provided with a chip bonding unit adsorbing the chip at the lower part. The chip bonding unit comprises a chip bonding unit body having an installation groove formed thereon, a pushing module having one end unit inserted and disposed into the installation groove, and an attachment module provided with a deformable member deformed by the pushing module. The deformable member may be provided with a deformable unit deformed by being pressed by the pushing module and having the chip adsorbed to a bottom surface thereof. Additionally, the chip bonding device capable of preventing bubbles from occurring between the chip and the substrate and a chip bonding method using the same can be provided. 본 발명의 실시예에 따른 칩 본딩 장치는 바디와, 상기 바디에 설치되어 기판을 이송하는 기판 이송 유닛과, 상기 바디의 상면에 배치되는 본드 헤드 이송 유닛과, 상기 바디에 설치되며 상기 기판의 위치 및 칩의 위치를 확인하는 정렬 유닛 및 상기 본드 헤드 이송 유닛에 설치되어 이동되며 하부에 칩을 흡착하는 본드 헤드를 포함하며, 상기 본드 헤드는 하단부에 칩을 흡착하는 칩 본딩부를 구비하며, 상기 칩 본딩부는 설치홈이 형성되는 칩 본딩부 바디와, 상기 설치홈에 일단부가 삽입 배치되는 푸싱 모듈 및 상기 푸싱 모듈에 의해 변형되는 변형부재를 구비하는 부착 모듈을 포함하며, 상기 변형부재에는 상기 푸싱 모듈에 의해 가압되어 변형되며 저면에 칩이 흡착되는 변형부가 구비될 수 있다.
Bibliography:Application Number: KR20210162166