LIGHT MOISTURE-CURABLE RESIN COMPOSITION HAVING EXCELLENT STORAGE STABILITY AND CURING PROPERTY

• Main Authors: YANG HEESANG, LEE KWANGDEOK, NAM CHUNRAE, LEE CHEOLWOO, SHIN CHANHO
• Format: Patent
• Language: English; Korean
• Published: 31.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention is a hybrid resin composition which can be dual-cured by light (UV) and moisture, and more specifically, can continuously ensure excellent storage stability by purification of raw materials and use of specific moisture removal additives, and can be cured sufficiently by light curing and moisture curing even in light-shielding areas where UV rays cannot pass through, resulting in high adhesion and high reliability. The hybrid resin composition of the present invention comprises a moisture-curing urethane resin, a photocurable monomer, a photoinitiator, and at least one moisture removal additive containing a formate-based compound. 본 발명은 광(UV) 및 습기에 의한 이중 경화가 가능한 하이브리드 (Hybrid)형 수지 조성물로서, 보다 상세하게는 원료 정제 및 특정 수분제거 첨가제의 사용으로 인해 우수한 저장안정성을 지속적으로 확보할 수 있고, 광 경화 및 습기 경화에 의해 자외선이 투과될 수 없는 차광부에서도 충분히 경화가 가능하여 고접착력 및 높은 신뢰성을 발휘할 수 있다.