3D HIGH DENSITY 3D INTERCONNECT CONFIGURATION
3D 상호연결(interconnect) 구조체가 다이(die)로의 전력 및 신호 전달을 위한 패키지 재배선 층(redistribution layer) 및/또는 칩렛(chiplet) 내에 통합되는 전자 패키지 구조체들 및 시스템들이 설명된다. 이러한 구조체들은 전력 전달을 실현 가능하게 유지하면서 입력 출력(IO) 밀도 및 신호들에 대한 라우팅 품질을 상당히 개선할 수 있다. Electronic package structures and systems are described in which a 3D interconnect struct...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English Korean |
| Published |
24.05.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | 3D 상호연결(interconnect) 구조체가 다이(die)로의 전력 및 신호 전달을 위한 패키지 재배선 층(redistribution layer) 및/또는 칩렛(chiplet) 내에 통합되는 전자 패키지 구조체들 및 시스템들이 설명된다. 이러한 구조체들은 전력 전달을 실현 가능하게 유지하면서 입력 출력(IO) 밀도 및 신호들에 대한 라우팅 품질을 상당히 개선할 수 있다.
Electronic package structures and systems are described in which a 3D interconnect structure is integrated into a package redistribution layer and/or chiplet for power and signal delivery to a die. Such structures may significantly improve input output (TO) density and routing quality for signals, while keeping power delivery feasible. |
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| AbstractList | 3D 상호연결(interconnect) 구조체가 다이(die)로의 전력 및 신호 전달을 위한 패키지 재배선 층(redistribution layer) 및/또는 칩렛(chiplet) 내에 통합되는 전자 패키지 구조체들 및 시스템들이 설명된다. 이러한 구조체들은 전력 전달을 실현 가능하게 유지하면서 입력 출력(IO) 밀도 및 신호들에 대한 라우팅 품질을 상당히 개선할 수 있다.
Electronic package structures and systems are described in which a 3D interconnect structure is integrated into a package redistribution layer and/or chiplet for power and signal delivery to a die. Such structures may significantly improve input output (TO) density and routing quality for signals, while keeping power delivery feasible. |
| Author | ZHAI JUN HU KUNZHONG DABRAL SANJAY CAO ZHITAO |
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| DocumentTitleAlternate | 고밀도 3D 상호연결 구성 |
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| Snippet | 3D 상호연결(interconnect) 구조체가 다이(die)로의 전력 및 신호 전달을 위한 패키지 재배선 층(redistribution layer) 및/또는 칩렛(chiplet) 내에 통합되는 전자 패키지 구조체들 및 시스템들이 설명된다. 이러한 구조체들은 전력 전달을 실현 가능하게... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | 3D HIGH DENSITY 3D INTERCONNECT CONFIGURATION |
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