유기 도전 필름의 제조 방법, 유기 도전 필름 및 적층체

• Main Authors: NISHIYAMA HIROYOSHI, SHODA RYO
• Format: Patent
• Language: Korean
• Published: 09.05.2023
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CABLES; CONDUCTORS; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

산계 유기 도전성 고분자, 알칼리 중화제 및 액상 매체를 포함하고, 25 ℃ 에 있어서의 pH 가 4.0 ∼ 6.5 인 도액을 조제하는 공정과, 도액을 기재층 상에 도포하는 공정과, 도포된 도액으로부터 액상 매체를 제거하는 공정을 구비하는, 유기 도전 필름의 제조 방법. A method for producing an organic conductive film includes a step of preparing a coating liquid containing an acid-based organic conductive polymer, an alkali neutralizing agent, and a liquid medium, and having a pH of 4.0 to 6.5 at 25°C, a step of applying the coating liquid to a base layer, and a step of removing the liquid medium from the applied coating liquid.