CURABLE COMPOSITION

• Main Author: NITTA AKI
• Format: Patent
• Language: English; Korean
• Published: 09.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

The purpose of the present invention is to provide a curable composition having a low cure shrinkage rate and excellent compatibility of components used. To achieve the purpose, a curable composition comprises: (1) a compound having a (meth)acryloyl group; (2) a polythiol compound; (3) at least one selected from the group consisting of a crystalline bisphenol type epoxy resin and a crystalline phenyl sulfide type epoxy resin; (4) a photo radical generator; and (5) a latent curing agent. [과제] 경화 수축률이 작고, 또한 사용하는 성분의 상용성이 우수한 경화성 조성물을 제공하는 것. [해결 수단] (1) (메타)아크릴로일기를 갖는 화합물, (2) 폴리티올 화합물, (3) 결정성 비스페놀형 에폭시 수지 및 결정성 페닐설파이드형 에폭시 수지로 이루어지는 그룹으로부터 선택되는 적어도 하나, (4) 광 라디칼 발생제 및 (5) 잠재성 경화제를 포함하는 경화성 조성물.