Visable ray absorbent epoxy flux film and manufacturing methods thereof

The present invention relates to an epoxy flux film, wherein after placing a functional film between a semiconductor substrate and a device, heating and pressurizing processes are performed without adding a separate flux, so that soldering and sealing processes between the device and the substrate a...

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Bibliographic Details
Main Authors JUNG KWANG MO, MOON JONG TAE
Format Patent
LanguageEnglish
Korean
Published 02.05.2023
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Summary:The present invention relates to an epoxy flux film, wherein after placing a functional film between a semiconductor substrate and a device, heating and pressurizing processes are performed without adding a separate flux, so that soldering and sealing processes between the device and the substrate are performed simultaneously and the interference phenomenon caused by reflected light of solders can be alleviated. 본 발명은 반도체 기판과 소자 사이에 기능성 필름을 위치한 다음, 별도의 플럭스 첨가 없이 가열 및 가압 공정을 수행함으로써 소자-기판 간의 솔더링 및 실링 공정이 동시에 이루어지며, 솔더의 반사광으로 인한 간섭 현상을 완화할 수 있는 에폭시 플럭스 필름에 관한 것이다.
Bibliography:Application Number: KR20210141921