커버 테이프 및 전자 부품 포장체

• Main Authors: SAWAGUCHI KOTA, NAKAJIMA GOSUKE, NABA KEISUKE
• Format: Patent
• Language: Korean
• Published: 27.04.2023
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

커버 테이프는, 기재층과, 히트 실링층을 적어도 갖고, 히트 실링층은, 측정 주파수 1Hz의 동적 점탄성 측정에 있어서, 150℃ 이하의 온도 영역에서의 손실 정접 tanδ가 1 미만이다. This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer has a loss tangent tan δ of less than 1 in a temperature range of 150° C. or less in a dynamic viscoelastic measurement at a measurement frequency of 1 Hz.