도료 조성물, 도막, 도막 부착 기재 및 그의 제조방법

• Main Author: KODAMA SHINSHO
• Format: Patent
• Language: Korean
• Published: 25.04.2023
• Subjects: ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

본 발명의 일실시형태는 도료 조성물, 도막, 도막 부착 기재 또는 그의 제조방법에 관한 것이고, 그 도료 조성물은 에폭시 수지(A), 실리콘 수지(B), 알루미늄(C), 및 아민계 경화제(D)를 함유한다. An embodiment of the present invention relates to a coating composition, a coating film, a substrate with a coating film, or a production method therefor. This coating composition includes an epoxy resin (A), a silicone resin (B), aluminum (C), and an amine curing agent (D).