CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: BAE SUBIN, KIM KOHOON, LIM SUNGHYUN
• Format: Patent
• Language: English; Korean
• Published: 10.04.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The present invention relates to a curable resin composition and a cured product thereof. According to the present invention, a cured product that realizes excellent curability and has excellent adhesive strength and water resistance can be provided. Therefore, according to the present invention, the curable resin composition can be usefully applied as a material for forming various optical members and optical devices, and in particular, can be usefully applied as an adhesive layer between components of a camera module or the like that requires high adhesive strength per unit area and water resistance. The curable resin composition comprises a thermosetting component A comprising a difunctional or higher epoxy-containing compound, a filler, and a silane compound containing an aromatic secondary amine group; and a photocurable component B comprising a difunctional or higher thiol compound, a difunctional or higher acrylate compound, and a photoinitiator. 본 발명은 경화형 수지 조성물 및 이의 경화물에 관한 것으로, 본 발명에 따르면 우수한 경화성을 구현함과 동시에 접착강도 및 내수성이 우수한 경화물을 제공할 수 있다. 이에, 본 발명에 따르면 각종 광학 부재 및 광학 장치를 형성하기 위한 재료로 유용하게 적용 가능하며, 특히 단위 면적당 높은 접착강도 및 내수성이 요구되는 카메라 모듈 등의 구성 부재 사이의 접착층으로 유용하게 적용될 수 있을 것으로 기대된다.