감광성 수지 조성물, 감광성 수지 필름, 다층 프린트 배선판 및 반도체 패키지, 및 다층 프린트 배선판의 제조 방법

• Main Authors: SAKAMOTO NORIHIKO, SAWAMOTO HAYATO, OTSUKA KOHEI, NAKAMURA AKIHIRO
• Format: Patent
• Language: Korean
• Published: 06.04.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

(A) 에틸렌성 불포화기를 가지는 광중합성 화합물, (X) 유기 입자 및 (B) 광중합 개시제를 함유하는 감광성 수지 조성물로서, 상기 (A) 에틸렌성 불포화기를 가지는 광중합성 화합물이, (A1) 에틸렌성 불포화기와 함께 산성 치환기 및 지환식 골격을 가지는 광중합성 화합물을 포함하는, 감광성 수지 조성물을 제공한다. 또한, 상기 감광성 수지 조성물로 이루어지는 감광성 수지 필름 및 층간 절연층용 감광성 수지 필름을 제공한다. 그리고, 다층 프린트 배선판 및 반도체 패키지를 제공한다. 또한, 상기 다층 프린트 배선판의 제조 방법을 제공한다. There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.