A SEMICONDUCTOR PACKAGE

A semiconductor package according to an embodiment of the present invention comprises: a lower substrate having a first surface and a second surface placed opposite to each other, the first surface having a chip mounting region, an interconnection region surrounding the chip mounting region, and an...

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Bibliographic Details
Main Authors CHOI PIL SUNG, MYUNG WOO RAM, KWON DONG UK, SHIN JI WON
Format Patent
LanguageEnglish
Korean
Published 05.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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