AMINE-BASED CURING AGENT AND COMPOSITION SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
An amine-based curing agent containing a compound represented by chemical formula 1, and a composition, a semiconductor package, and an electronic device including the same are provided. The definition of the chemical formula 1 is as described in the detailed description. The amine-based curing agen...
Saved in:
Main Authors | , , , , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
04.04.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An amine-based curing agent containing a compound represented by chemical formula 1, and a composition, a semiconductor package, and an electronic device including the same are provided. The definition of the chemical formula 1 is as described in the detailed description. The amine-based curing agent can improve the thermal conductivity of a cured product.
하기 화학식 1로 표현되는 화합물을 포함하는 아민계 경화제, 및 이를 포함하는 조성물, 반도체 패키지 및 전자 소자를 제공한다. [화학식 1] JPEGpat00033.jpg34127 화학식 1의 정의는 상세한 설명에 기재된 바와 같다. |
---|---|
Bibliography: | Application Number: KR20210127925 |