AMINE-BASED CURING AGENT AND COMPOSITION SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

An amine-based curing agent containing a compound represented by chemical formula 1, and a composition, a semiconductor package, and an electronic device including the same are provided. The definition of the chemical formula 1 is as described in the detailed description. The amine-based curing agen...

Full description

Saved in:
Bibliographic Details
Main Authors LEE, MOO HO, NOH, CHANG HO, SEO, BYUNG HWA, LEE, IN SU, PANG, KYEONG, KIM, IN, PARK DA HYE
Format Patent
LanguageEnglish
Korean
Published 04.04.2023
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:An amine-based curing agent containing a compound represented by chemical formula 1, and a composition, a semiconductor package, and an electronic device including the same are provided. The definition of the chemical formula 1 is as described in the detailed description. The amine-based curing agent can improve the thermal conductivity of a cured product. 하기 화학식 1로 표현되는 화합물을 포함하는 아민계 경화제, 및 이를 포함하는 조성물, 반도체 패키지 및 전자 소자를 제공한다. [화학식 1] JPEGpat00033.jpg34127 화학식 1의 정의는 상세한 설명에 기재된 바와 같다.
Bibliography:Application Number: KR20210127925