Laminate for Copper Clad Laminate Manufacturing Method Thereof and Method for Preparing Fine Pitch Circuit Pattern

• Main Authors: CHOI YOUNG MIN, LEE SU YEON, HWANG JEONG HEE, KIM TAE SU, JUNG SUNG MOOK
• Format: Patent
• Language: English; Korean
• Published: 21.03.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a manufacturing method of a laminate for a copper clad laminate, wherein the manufacturing method of the copper clad laminate according to the present invention comprises: a) a step of forming a photoresist coating film on an upper part of an insulation base; and b) a step of applying metal nanoparticles on an upper part of the photoresist coating film, and embedding the coated metal nanoparticles in the photoresist coating film. Therefore, the present invention is capable of having an advantage of further improving an adhesive strength. 본 발명은 동박 적층판용 적층체의 제조방법에 관한 것으로, 본 발명에 따른 동박 적층판의 제조방법은 a) 절연성 기재 상부에 포토레지스트 코팅막을 형성하는 단계; 및 b) 상기 포토레지스트 코팅막 상부에 금속 나노입자를 도포하고, 도포된 금속 나노입자를 상기 포토레지스트 코팅막에 임베딩(embedding)하는 단계; 를 포함한다.