플럭스 및 솔더 페이스트

활성제로서의 2-하이드록시아이소뷰티르산을 0.1∼20wt%와, 양이온계 계면활성제를 10∼60wt%와, 비이온계 계면활성제를 5∼60wt%를 포함하는 플럭스. 솔더 페이스트는, 이 플럭스와, 금속분을 포함한다. A flux containing 0.1 to 20 wt% of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt% of a cationic surfactant and 5 to 60 wt% of a nonionic surfactant. A solder paste contains t...

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Bibliographic Details
Main Authors YAMADA YO, YAMAGAME TOMOHIRO
Format Patent
LanguageKorean
Published 10.03.2023
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:활성제로서의 2-하이드록시아이소뷰티르산을 0.1∼20wt%와, 양이온계 계면활성제를 10∼60wt%와, 비이온계 계면활성제를 5∼60wt%를 포함하는 플럭스. 솔더 페이스트는, 이 플럭스와, 금속분을 포함한다. A flux containing 0.1 to 20 wt% of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt% of a cationic surfactant and 5 to 60 wt% of a nonionic surfactant. A solder paste contains this flux and a metal powder.
Bibliography:Application Number: KR20237006870