SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

A semiconductor device having an EMI shielding layer and/or an EMI shielding wire and a manufacturing method thereof are provided. In an exemplary embodiment, a semiconductor device includes: a semiconductor die; an EMI shielding layer shielding the semiconductor die; and an encapsulating part encap...

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Bibliographic Details
Main Authors KIM KYE RYUNG, PARK SUNG SUN, KIM DAE GON, KWANG MO CHRIS LIM, NA JAE MIN, KIM SOO HYUN, HWANG TAE KYUNG
Format Patent
LanguageEnglish
Korean
Published 10.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device having an EMI shielding layer and/or an EMI shielding wire and a manufacturing method thereof are provided. In an exemplary embodiment, a semiconductor device includes: a semiconductor die; an EMI shielding layer shielding the semiconductor die; and an encapsulating part encapsulating the EMI shielding layer. In another exemplary embodiment, a semiconductor device further includes: an EMI shield wire extended from the EMI shield layer to shield a semiconductor die. EMI 차폐층 및/또는 EMI 차폐 와이어를 갖는 반도체 장치 및 그 제조 방법이 제공된다. 예시적인 실시예에서, 반도체 장치는 반도체 다이, 반도체 다이를 차폐하는 EMI 차폐층 및 EMI 차폐층을 인캡슐레이팅하는 인캡슐레이팅 부분을 포함한다. 다른 예시적인 실시예에서, 반도체 장치는 EMI 차폐층으로부터 연장되어 반도체 다이를 차폐하는 EMI 차폐 와이어를 더 포함한다.
Bibliography:Application Number: KR20230022830