METHOD FOR WORKING MOLD

• Main Author: SEONG, NAK HOON
• Format: Patent
• Language: English; Korean
• Published: 08.03.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The present invention relates to a processing method of a type one mold. The processing method of the type one mold of the present invention comprises the following steps of: forming a photosensitive layer on a substrate; forming a protrusion unit and a space unit in the photosensitive layer through exposure and a development process, and developing a tapered shape in which a lower width of the space unit is wider than an upper width of the space unit; sputtering the protrusion unit and the space unit; forming an electro-processed object through electro-processing of a spattering unit; and forming the type one mold by removing the substrate and a photosensitive material from the electro-processed object. A residual photosensitive material remains on the surface of the substrate at a space unit lower part of a portion. According to the present invention, easy production becomes possible. 본 발명은 1형태 금형의 가공방법에 관한 것으로, 기판에 감광층을 형성하는 단계; 상기 감광층에 노광 및 현상공정을 통하여 돌출부와 공간부를 형성하되, 공간부의 하부폭이 공간부의 상부폭에 비하여 넓은 테이퍼 형상으로 현상하는 단계; 상기 돌출부와 공간부에 스파터링을 하는 단계; 스파트링부에 전주가공을 통하여 전주가공물을 형성하는 단계; 및 상기 전주가공물로부터 기판과 감광재를 제거하여 1형태 금형을 형성하는 단계를 포함하고, 일부의 공간부 하부에는 잔존 감광재가 기판 표면에 남아 있다.