backside - station-varying support features - MULTI-STATION PROCESSING TOOLS WITH STATION-VARYING SUPPORT FEATURES FOR BACKSIDE PROCESSING

• Main Authors: DHAS ARUL N, SHAIKH FAYAZ A, LINEBARGER NICK RAY JR
• Format: Patent
• Language: English; Korean
• Published: 16.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

배면 프로세싱을 위한 스테이션-가변 지지 피처들을 갖는 멀티-스테이션 프로세싱 툴들이 제공된다. 제 1 스테이션의 지지 피처들은 제 1 세트의 지점들에서 배면 증착, 배면 증착 차단, 에칭, 또는 다른 프로세싱 동안 이들 지점들에서 웨이퍼를 홀딩할 수도 있다. 제 2 스테이션의 지지 피처들은 제 1 세트의 지점들과 오버랩되지 않는 제 2 세트의 지점들에서 웨이퍼를 홀딩할 수도 있다. Multi-station processing tools with station-varying support features for backside processing are provided. The support features in a first station may hold a wafer at a first set of points during backside deposition, blocking backside deposition, etching, or other processing at those points. The support features in a second station may hold a wafer at a second set of points that don't overlap with the first set of points.