Semiconductor device and method for fabricating the same

Provided is a semiconductor device. The semiconductor device comprises: a substrate; a first interlayer insulating film arranged on the substrate; a first wiring pattern arranged inside a first trench formed on the first interlayer insulating film; a second interlayer insulating film arranged on the...

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Bibliographic Details
Main Authors JANG HAN MIN, NOH SUN YOUNG, LEE EUI BOK, KIM WAN DON
Format Patent
LanguageEnglish
Korean
Published 30.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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