YTTRIUM THERMAL SPRAYING COATING AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: HAMAYA NORIAKI, TAKAI YASUSHI
• Format: Patent
• Language: English; Korean
• Published: 20.01.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides a yttrium-based thermal spray coating which has a thickness of 10 to 500 μm and contains one or more of yttrium oxide, yttrium fluoride, and yttrium oxyfluoride, and in which the number of particles having a particle size of 300 nm or less and existing on the surface of the coating is 5 or less per 1 mm^2. The yttrium-based thermal spray coating exhibits excellent corrosion resistance even in a halogen-based gas plasma atmosphere, and prevents dust generation due to exfoliation of yttrium-based particles in etching treatment of a semiconductor manufacturing process, thereby effectively improving the yield of semiconductor manufacturing. [해결수단] 산화이트륨, 불화이트륨 및 옥시불화이트륨의 1종 또는 2종 이상을 포함하는 두께 10 내지 500㎛의 이트륨계 용사 피막이며, 해당 피막 표면에 존재하는 입경 300㎚ 이하의 입자의 수가 1㎟당 5개 이하인 것을 특징으로 하는 이트륨계 용사 피막. [효과] 할로겐계 가스 플라즈마 분위기에서도 우수한 내부식성을 발휘하고, 또한 반도체 제조 공정에 있어서의 에칭 처리에 있어서 이트륨계 입자의 박락에 의한 발진을 가급적 방지하여, 반도체 제조의 수율을 효과적으로 향상시킬 수 있다.