SUBSTRATE STRUCTURE CONNECTING BASED ON SOLDER BALL AND ELASTIC BODY

According to one embodiment, a substrate structure comprises: a first substrate; a plurality of first elastomer pins disposed on the first substrate; an elastic body disposed on a first substrate to surround the plurality of first elastomer pins, and comprising a plurality of spaces for accommodatin...

Full description

Saved in:
Bibliographic Details
Main Authors BAE BUMHEE, CHEON JEONGNAM, SHIM JONGWAN, KIM YOUNHO
Format Patent
LanguageEnglish
Korean
Published 17.01.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:According to one embodiment, a substrate structure comprises: a first substrate; a plurality of first elastomer pins disposed on the first substrate; an elastic body disposed on a first substrate to surround the plurality of first elastomer pins, and comprising a plurality of spaces for accommodating a plurality of solder balls on a second substrate connected to the first substrate; and a plurality of solder ball holders disposed in a boundary area of each opening part of the plurality of spaces, wherein each of the plurality of solder ball holders has a higher strength than that of the elastic body and may comprise a plurality of pieces. Therefore, the present invention has improved mechanical fastening force. 일 실시예에 따라서, 기판 구조는, 제1 기판, 상기 제1 기판 상에 배치된 복수의 제1 엘라스토머 핀, 상기 복수의 제1 엘라스토머 핀을 감싸도록 제1 기판 상에 배치되며, 제1 기판에 연결된 제2 기판 상의 복수의 솔더볼을 수용하기 위한 복수의 공간을 포함하는 탄성체 및 복수의 공간 각각의 개구부의 경계 영역에 배치되는 복수의 솔더볼 홀더를 포함하고, 복수의 솔더볼 홀더 각각은, 탄성체보다 강도가 높고 복수의 피스를 포함할 수 있다.
Bibliography:Application Number: KR20210089904