POLYAMIDE ACID POLYIMIDE POLYIMIDE FILM METAL-CLAD LAMINATE AND CIRCUIT

• Main Author: ANDO TOMONORI
• Format: Patent
• Language: English; Korean
• Published: 06.01.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The present invention provides a polyimide film which has low thermal expansion, low hygroscopicity, and good film forming properties required as an FPC material, and also has a sufficiently low dielectric tangent. According to the present invention, a polyamic acid or polyimide containing an acid dianhydride residue derived from an acid dianhydride component and a diamine residue derived from a diamine component satisfies: a condition (i) of containing 25 mol% or more of an acid dianhydride residue derived from an acid dianhydride represented by following formula (1), with respect to all acid dianhydride residues; a condition (ii) of containing 50 mol% or more of a diamine residue derived from a diamine compound represented by following general formula (2), with respect to all diamine residues, wherein in the formula (2), Y independently represents hydrogen, a monovalent hydrocarbon group having 1-3 carbon atoms, or an alkoxy group, and p and q independently represent integers from 0-4; and a condition (iii) in which a ratio of a monomer residue having a biphenyl skeleton is 65 mol% or more, with respect to all monomer residues derived from all monomer components. (과제) 본 발명은, FPC 재료로서 요구되는 저열팽창성, 저흡습성, 양호한 제막성을 구비하고, 또한 유전정접이 충분히 낮은 폴리이미드 필름을 제공한다. (해결수단) 산이무수물 성분으로부터 유도되는 산이무수물 잔기 및 디아민 성분으로부터 유도되는 디아민 잔기를 함유하는 폴리아미드산 또는 폴리이미드로서, 조건(ⅰ) : 전체 산이무수물 잔기에 대하여, 하기의 식(1)로 나타내는 산이무수물로부터 유도되는 산이무수물 잔기를 25mol％ 이상 함유하는 것, JPEGpat00016.jpg30133 조건(ⅱ) : 전체 디아민 잔기에 대하여, 하기의 일반식(2)로 나타내는 디아민 화합물로부터 유도되는 디아민 잔기를 50mol％ 이상 함유하는 것, JPEGpat00017.jpg2384 [식(2)에 있어서, Y는 독립하여 수소, 탄소수 1∼3의 1가의 탄화수소기 또는 알콕시기를 나타내고, p 및 q는 독립하여 0∼4의 정수를 나타낸다] 조건(ⅲ) : 전체 모노머 성분으로부터 유도되는 전체 모노머 잔기에 대하여, 비페닐 골격을 구비하는 모노머 잔기의 비율이 65mol％ 이상인 것을 만족한다.