SUBSTRATE PROCESSING METHOD

• Main Authors: TAKEMATSU YUSUKE, ISHIKAWA HIDEKAZU, ISHIMARU AKIRA, TSUKAHARA RYUTA
• Format: Patent
• Language: English; Korean
• Published: 04.01.2023
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; NOZZLES; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The present invention provides a substrate processing method capable of suppressing a problem caused by a suction motion when processing a substrate. A substrate processing device includes: a multi-way valve capable of selectively supplying at least one of a processing liquid for processing the substrate and a cleaning liquid for cleaning the substrate; a processing liquid nozzle for discharging the processing liquid to the substrate; a connection pipe connecting the multi-way valve and the processing liquid nozzle; and a suction pipe formed by being divided from the connection pipe and for sucking the inside of the connection pipe. The substrate processing method includes a process of cleaning the inside of the suction pipe by supplying the cleaning liquid from the multi-way valve to the suction pipe. (과제) 기판 처리에 있어서의 흡인 동작에서 기인하는 문제를 억제한다. (해결 수단) 기판 처리 방법은, 적어도, 기판을 처리하기 위한 처리액과 세정을 실시하기 위한 세정액 중 적어도 일방을 선택적으로 공급 가능한 다련 밸브와, 기판에 처리액을 토출하기 위한 처리액 노즐과, 다련 밸브와 처리액 노즐을 접속하는 접속 배관과, 접속 배관으로부터 분기하여 형성되고, 또한, 접속 배관 내를 흡인하기 위한 흡인 배관을 구비하고, 다련 밸브로부터 흡인 배관으로 세정액을 공급함으로써 흡인 배관 내를 세정하는 공정을 구비한다.