SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION

• Main Authors: CHEN CHIH HUNG, CHEN KEI WEI, CHEN YING TSUNG, NIEN PO CHIN, HOU TE CHIEN
• Format: Patent
• Language: English; Korean
• Published: 30.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

According to the present invention, a chemical mechanical planarization system comprises a chemical mechanical planarization pad that rotates during the chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies slurry onto the pad during the process. A pad conditioner conditions the pad during the process. An impurity removal system removes debris and impurities from the slurry. 화학적 기계적 평탄화 시스템은 화학적 기계적 평탄화 프로세스 동안 회전하는 화학적 기계적 평탄화 패드를 포함한다. 화학적 기계적 평탄화 헤드는 프로세스 동안 화학적 기계적 평탄화 패드와 접촉하게 반도체 웨이퍼를 배치한다. 슬러리 공급 시스템은 프로세스 동안 패드 상으로 슬러리를 공급한다. 패드 컨디셔너는 프로세스 동안 패드를 컨디셔닝한다. 불순물 제거 시스템은 슬러리로부터 잔해물과 불순물을 제거한다.