Floor impact sound reduction structure with damping adhesives

• Main Authors: HONG SEONG SHIN, CHUNG MIN HO, CHOI YOUNGLAK, KOO BON SOO
• Format: Patent
• Language: English; Korean
• Published: 26.12.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BUILDING; CHEMISTRY; DYES; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS; FIXED CONSTRUCTIONS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The present invention relates to a floor structure for reducing floor impact sound using a damping adhesive. Since a damping adhesive layer, which is a silicone-based adhesive provided between the floor and a floor panel, exhibits elasticity after curing, the floor structure can absorb and attenuate...