Floor impact sound reduction structure with damping adhesives

• Main Authors: HONG SEONG SHIN, CHUNG MIN HO, CHOI YOUNGLAK, KOO BON SOO
• Format: Patent
• Language: English; Korean
• Published: 26.12.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BUILDING; CHEMISTRY; DYES; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS; FIXED CONSTRUCTIONS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The present invention relates to a floor structure for reducing floor impact sound using a damping adhesive. Since a damping adhesive layer, which is a silicone-based adhesive provided between the floor and a floor panel, exhibits elasticity after curing, the floor structure can absorb and attenuate external impact to reduce floor impact sound. The floor structure for reducing floor impact sound using the damping adhesive of the present invention is a floor structure constructed on a base surface of the floor, comprising: a damping adhesive layer, which is a silicon-based adhesive, applied to an upper surface of the base surface; and a floor panel attached to an upper part of the damping adhesive layer. 본 발명은 바닥과 마루패널 사이에 구비되는 실리콘계 접착제인 댐핑접착층이 경화 후 탄성 특징을 나타내므로, 외부 충격을 흡수하고 감쇄하여 바닥충격음을 저감할 수 있는 댐핑접착제를 이용한 바닥충격음 저감용 마루 구조에 대한 것이다. 본 발명 댐핑접착제를 이용한 바닥충격음 저감용 마루 구조는 바닥의 바탕면에 시공되는 마루 구조에 관한 것으로, 상기 바탕면의 상면에 도포되는 것으로 실리콘계 접착제인 댐핑접착층; 및 상기 댐핑접착층의 상부에 부착되는 마루패널; 로 구성되는 것을 특징으로 한다.