MOLDING APPARATUS MOLDING METHOD AND PRODUCT MANUFACTURING METHOD

• Main Author: OTA SHUNSUKE
• Format: Patent
• Language: English; Korean
• Published: 22.12.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

According to the present invention, a curing treatment for curing a curable composition is performed, in a state where a mold held and supported by a mold holding and supporting unit and a substrate held and supported by a substrate holding and supporting unit are in contact with each other through the curable composition, and a mold release treatment of the mold from the substrate is performed after the curing treatment. If the mold release treatment fails, an additional curing treatment is performed. Accordingly, the mold can be released without performing a recovery treatment by an operator, and thus a molding apparatus which is advantageous in terms of productivity can be provided. 몰드 보유지지 유닛에 의해 보유지지된 몰드와 기판 보유지지 유닛에 의해 보유지지된 기판이 경화성 조성물을 통해 서로 접촉하는 상태에서 경화성 조성물을 경화시키는 경화 처리가 행해지며, 경화 처리 후에 기판으로부터의 몰드의 몰드 이형 처리가 행해진다. 몰드 이형 처리가 실패한 경우, 추가의 경화 처리가 행해진다. 이에 의해, 오퍼레이터에 의한 리커버리 처리를 행하지 않고도, 몰드를 이형할 수 있어, 생산성에서 유리한 성형 장치를 제공할 수 있다.