A PACKAGING BOX

The present invention is to provide a packaging box capable of preventing damage to semiconductor products from external impacts. A packaging box of the present disclosure comprises zigzag-type left and right upper shock protection structures which cover the upper side of an accommodating space defi...

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Bibliographic Details
Main Authors PARK SUN HONG, OH HYUN JONG, LEE JAE CHAN, LEE EUN HYE, CHUN YUN HEE, YANG JIN KYU
Format Patent
LanguageEnglish
Korean
Published 24.11.2022
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Summary:The present invention is to provide a packaging box capable of preventing damage to semiconductor products from external impacts. A packaging box of the present disclosure comprises zigzag-type left and right upper shock protection structures which cover the upper side of an accommodating space defined by front, rear, left side, and right side walls, and zigzag-type left and right lower shock protection structures which cover the lower side of the accommodating space. 본 개시의 포장 박스는, 앞 벽, 뒷 벽, 좌측 벽, 및 우측 벽에 의해 규정되는 수용 공간의 상부를 덮는 지그-재그 구조의 좌상측 충격 방지 구조체 및 우상측 충격 방지 구조체를 포함하고, 상기 수용 공간의 하부를 덮는 재그-재그 구조의 좌하측 충격 방지 구조체 및 우하측 충격 방지 구조체를 포함할 수 있다.
Bibliography:Application Number: KR20210063618