ADHESIVE COMPOSITION

• Main Authors: FUKUI TAKAHIRO, SHIRAKAWA TETSUYUKI, ASAKAWA YUSUKE, KUMADA TATSUYA, MATSUMOTO SATORU
• Format: Patent
• Language: English; Korean
• Published: 22.11.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

본 발명의 일 측면은, 전자 부재끼리의 접속에 사용되는 접착제 조성물로서, 전자 부재에 있어서의 전극의 표면에 형성되는 산화 피막을 관통 가능한 돌기부를 갖는 도전 입자인 제1 도전 입자와, 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 형성된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는 접착제 조성물에 관한 것이다. One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.