SUBSTRATE PROCESSING APPARATUS SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

A top plate is held by an opposing member holder in a first position and rotated together with a substrate holder while being held by a substrate holder in a second position. In a substrate processing apparatus, a first processing liquid supply unit, a second processing liquid supply unit, a nozzle...

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Bibliographic Details
Main Authors MURAMOTO RYO, TAKAHASHI MITSUKAZU
Format Patent
LanguageEnglish
Korean
Published 11.11.2022
Subjects
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NOZZLES
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:A top plate is held by an opposing member holder in a first position and rotated together with a substrate holder while being held by a substrate holder in a second position. In a substrate processing apparatus, a first processing liquid supply unit, a second processing liquid supply unit, a nozzle moving mechanism are controlled by a control unit, so that a first processing liquid nozzle is located at a supply position in a holding portion of the top plate. In this state, a first processing liquid is supplied to a substrate through an opposing member opening, so that a first processing liquid nozzle moves from the supply position to a retracted position. Then, a second processing liquid nozzle is moved from the retracted position to the supply position, and a second processing liquid is supplied to the substrate through the opening of the opposing member. In this way, it is possible to suppress or prevent a mixture of a plurality of types of processing liquids, compared to the case where a plurality of types of processing liquids are sequentially supplied from one processing liquid nozzle. 탑 플레이트는, 제 1 위치에서 대향 부재 유지부에 의해 유지되고, 제 2 위치에서 기판 유지부에 의해 유지됨과 함께 기판 유지부와 함께 회전된다. 기판 처리 장치에서는, 제어부에 의해, 제 1 처리액 공급부, 제 2 처리액 공급부 및 노즐 이동 기구가 제어됨으로써, 제 1 처리액 노즐이, 탑 플레이트의 피유지부 내의 공급 위치에 위치하는 상태에서, 대향 부재 개구를 통해 제 1 처리액이 기판에 공급되어, 제 1 처리액 노즐이 공급 위치로부터 퇴피 위치로 이동한다. 그리고, 제 2 처리액 노즐이 퇴피 위치로부터 공급 위치로 이동하고, 대향 부재 개구를 통해 제 2 처리액이 기판에 공급된다. 이로써, 1 개의 처리액 노즐로부터 복수 종류의 처리액을 순차적으로 공급하는 경우에 비하여, 복수 종류의 처리액의 혼액을 억제 또는 방지할 수 있다.
Bibliography:Application Number: KR20220139443