FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES

• Main Authors: KUAH TENG HOCK, LIAO JIAN, YAN KAR WENG, CAMBA ROLAN OCUAMAN, DING JIAPEI
• Format: Patent
• Language: English; Korean
• Published: 11.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An objective of the present invention is to improve a process of applying a sintering pressure across a semiconductor device. A device having a sealing plate including stiff hard portions and one or more flexible soft portions positioned between the hard portions is used to bond at least one semicon...