Room temperature curing and hardness adjustable polyol modified aspartic two components type poly urea heat dissipation adhesive composition

• Main Authors: KIM HYUN JOO, CHANG JUN GIL, SEO KYEONG HUN
• Format: Patent
• Language: English; Korean
• Published: 04.11.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The present invention relates to a polyol-modified aspartic two-component polyurea heat-dissipating adhesive composition capable of room temperature curing and hardness control and, more particularly, to a polyol-modified aspartic two-component polyurea heat-dissipating adhesive composition capable...