Room temperature curing and hardness adjustable polyol modified aspartic two components type poly urea heat dissipation adhesive composition

• Main Authors: KIM HYUN JOO, CHANG JUN GIL, SEO KYEONG HUN
• Format: Patent
• Language: English; Korean
• Published: 04.11.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The present invention relates to a polyol-modified aspartic two-component polyurea heat-dissipating adhesive composition capable of room temperature curing and hardness control and, more particularly, to a polyol-modified aspartic two-component polyurea heat-dissipating adhesive composition capable of room temperature curing and hardness control by mixing an aspartic ester resin and a polyol, wherein the composition contains: a main ingredient containing the aspartic ester resin and the polyol; a curing agent containing polyisocyanate; and a thermally conductive inorganic filler. 본 발명은, 상온경화 및 경도조절이 가능한 폴리올 변성 아스파틱 이액형 폴리우레아계 방열접착제 조성물에 관한 것으로, 보다 상세하게는, 아스파틱 에스테르 수지 및 폴리올을 포함하는 주제와; 폴리이소시아네이트를 포함하는 경화제; 및 열전도성 무기필러;를 포함하여 조성되어 아스파틱 에스테르 수지 및 폴리올 혼합에 따라 상온경화 및 경도조절이 가능한 폴리올 변성 아스파틱 이액형 폴리우레아계 방열접착제 조성물에 관한 것이다.