RETAINER-RING

• Main Author: HWANG JUNG HO
• Format: Patent
• Language: English; Korean
• Published: 02.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention is to provide a retainer ring capable of minimizing the stress applied to the outer end of a wafer so as to improve the yield of the wafer. A retainer ring having an annular body and used in a CMP process according to an embodiment of the present invention comprises a pad pressing surface formed to be inclined upward from the inner peripheral part surrounding a wafer to the outer peripheral part at the lower end of the body, a plurality of first grooves arranged at regular intervals in the circumferential direction of the lower end of the body on the pad pressing surface to form a slurry discharge path, and second grooves recessed to cross the first grooves in the circumferential direction of the lower end of the body on the pad pressing surface. 본 발명의 일 실시예에 따른 CMP 공정에서 이용되는 환형 몸체의 리테이너 링은, 몸체 하단부에 웨이퍼를 감싸는 내경부에서 외경부로 갈수록 상향 경사지게 형성되는 패드 가압면과, 패드 가압면상에서 몸체 하단부의 원주 방향을 따라 소정의 간격으로 배치되어 슬러리 배출로를 이루는 복수의 제1 그루브와, 패드 가압면상에서 몸체 하단부의 원주 방향을 따라 제1 그루브와 교차되게 함몰 형성되는 제2 그루브를 포함한다.