광 습기 경화성 수지 조성물, 전자 부품용 접착제, 전자 부품의 제조 방법 및 경화체

• Main Authors: KIDA TAKUMI, TAMAGAWA TOMOKAZU, JO KON, YUUKI AKIRA, TOMITA YOSHIKI
• Format: Patent
• Language: Korean
• Published: 12.10.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

본 발명의 광 습기 경화성 수지 조성물은, 라디칼 중합성 화합물과, 습기 경화성 우레탄 수지와, 광중합 개시제를 포함하고, 상기 습기 경화성 우레탄 수지는, 폴리에스테르 골격을 갖는 습기 경화성 우레탄 수지를 포함하고, 자외선을 1000mJ/cm2 조사함으로써 광경화된 상태의 경화물에 대해, 0.04MPa의 하중을 작용시켰을 때에, 하중 전후의 두께 변화율이 50% 이하이다. A photo/moisture curable resin composition according to the present invention contains a radically polymerizable compound, a moisture curable urethane resin and a photopolymerization initiator; the moisture curable urethane resin contains a moisture curable urethane resin that has a polyester skeleton; and if a load of 0.04 MPa is applied to a photocured product thereof obtained by means of ultraviolet light irradiation of 1,000 mJ/cm2, the thickness change ratio before and after the application of load is 50% or less.