Organometallic adduct compounds and method of manufacturing integrated circuit device using the same
The present invention relates to an organometallic adduct compound of formula (I) and a method of manufacturing an integrated circuit device using the same to form a metal-containing film on a substrate. [Formula (I)]. In formula (1), R^1, R^2, R^3, R^4, and R^5 are each independently a hydrogen ato...
Saved in:
Main Authors | , , , , , , , , , , , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
12.10.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present invention relates to an organometallic adduct compound of formula (I) and a method of manufacturing an integrated circuit device using the same to form a metal-containing film on a substrate. [Formula (I)]. In formula (1), R^1, R^2, R^3, R^4, and R^5 are each independently a hydrogen atom, a halogen atom, a substituted or unsubstituted C1-C5 straight-chain alkyl group, a substituted or unsubstituted C3-C5 branched alkyl group, a substituted or unsubstituted C2-C5 straight-chain alkenyl group, or a substituted or unsubstituted C3-C5 branched alkenyl group, X is a halogen atom, and M is a niobium atom or a tantalum atom.
다음 일반식 (I)의 유기금속 부가 화합물 및 이를 사용하여 기판 위에 금속 함유막을 형성하는 집적회로 소자의 제조 방법을 개시한다. 일반식 (I) JPEGpat00084.jpg4878 일반식 (I)에서, R1, R2, R3, R4, 및 R5는 각각 독립적으로 수소 원자, 할로겐 원자, 치환 또는 비치환된 C1-C5의 직쇄형 알킬기, 치환 또는 비치환된 C3-C5의 분기형 알킬기, 치환 또는 비치환된 C2-C5의 직쇄형 알케닐기, 또는 치환 또는 비치환된 C3-C5의 분기형 알케닐기이고, X는 할로겐 원자이고, M은 니오븀 원자 또는 탄탈륨 원자임. |
---|---|
Bibliography: | Application Number: KR20210123465 |