TSV OVERSIZED VIA AS THROUGH-SUBSTRATE-VIATSV STOP LAYER

• Main Authors: YAUNG DUN NIAN, LIN HSING CHIH, KAO MIN FENG, CHU YI SHIN, LIU JEN CHENG, CHEN PING TZU
• Format: Patent
• Language: English; Korean
• Published: 11.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Some embodiments of the present invention relate to an integrated chip structure. The integrated chip structure includes standard vias disposed on a first side of a substrate. Oversized vias are disposed on the first side of the substrate and are laterally separated from the standard vias. The overs...