COMPONENT RECEIVING DEVICE

• Main Authors: IWAMOTO KOICHI, KUDO ATSUSHI, TAMAMURA SHINICHI, OKUNUKI TAICHI
• Format: Patent
• Language: English; Korean
• Published: 30.09.2022
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING RECORD CARRIERS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHYSICS; PRESENTATION OF DATA; PRINTED CIRCUITS; RECOGNITION OF DATA; RECORD CARRIERS

A component receiving device capable of automatically receiving a plurality of components in a case and managing components is provided. The component receiving device includes: a plurality of installation parts (240) in which a plurality of cases (1) are installed, respectively; a plurality of conveying parts (210) for continuously conveying a plurality of electronic components (50) respectively for the plurality of installation parts (240); and a discharge part (230) disposed between the conveying parts (210) and the installation parts (240) and allowing the electronic components (50) to fall from the conveying parts (210) toward an outlet (opening) (6) of the cases (1) installed in the installation parts (240) one by one by the own weight thereof. The conveying parts (210) include: a vibration conveying part (211) that conveys the electronic components (50) by vibration; and a non-vibration conveying part (220) disposed between the vibration conveying part (211) and the discharge part (230). The non-vibration conveying part (220) is provided with a conveying part detecting unit (279) that detects the electronic components (50) conveyed in the non-vibration conveying part (220). 케이스 안에 다수개의 부품을 자동으로 수용할 수 있음과 함께, 부품관리를 할 수 있는 바와 같은 부품 수용장치를 제공한다. 복수개의 케이스(1) 각각이 설치되는 복수개의 설치부(240)와, 복수개의 설치부(240) 각각에 대하여, 복수개의 전자부품(50)을 연속적으로 반송하는 복수개의 반송부(210)와, 반송부(210)와 설치부(240) 사이에 배치되며 반송부(210)로부터, 설치부(240)에 설치된 케이스(1)의 배출구(개구)(6)를 향해 전자부품(50)을 1개씩 자중으로 낙하시키는 배출부(230)를 포함하고, 반송부(210)는 진동에 의해 전자부품(50)을 반송하는 진동 반송부(211)와, 진동 반송부(211)와 배출부(230) 사이에 배치된 무진동 반송부(220)를 포함하며, 무진동 반송부(220)에는 상기 무진동 반송부(220)로 반송되는 전자부품(50)을 검지하는 반송부품 검지부(279)가 병설된다.