Surface-Treated Copper Foil

• Main Authors: CHENG KUEI SEN, CHOU JUI CHANG, HUANG HUEI FANG
• Format: Patent
• Language: English; Korean
• Published: 21.09.2022
• Subjects: ADHESIVES; APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; USE OF MATERIALS THEREFOR; WOODSTAINS

The present disclosure relates to a surface-treated copper foil with improved corrosion and discoloration resistance. More specifically, the surface-treated copper foil does not contain chromium, and contains: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to one or both sides of the copper foil or to one or both barrier layer(s), wherein a sum of N, S, and Si elements in the organic layer is greater than 5 normalized element %. 본 개시는 개선된, 부식 및 변색에 저항성인 표면-처리된 구리 호일에 관한 것이다. 보다 구체적으로, 표면-처리된 구리 호일은 크롬을 미포함하며, (a) 구리 호일; 선택적으로, (b) 구리 호일의 일면 또는 양면 상의 장벽층으로서, Ni, Zn, Co, Mn, Sn 또는 이들의 혼합물을 포함하는, 장벽층; 및 (c) 구리 호일의 일면 또는 양면 또는 하나 또는 양쪽의 장벽층(들)에 커플링된 유기층을 포함하고, 유기층의 N, S, 및 Si 원소의 총합은 5 정규화 원소% 초과이다.